发明名称 POLYAMIDE ADHESIVE COMPOSITION
摘要 PURPOSE: Provided is a polyamide adhesive composition which has excellent adhesion and compatibility, and thus shows single glass transition temperature and stable melt stability even at high temperature, and which can easily form an adhesive sheet. CONSTITUTION: The composition comprises (a) 40-90 parts by weight of thermoplastic polyamide predominantly consisting of dimeric fatty acid, (b) 5-60 parts by weight of olefinic polymer or oligomer obtained by synthesizing an olefin monomer of C2-C5 and a monomer simultaneously having a functional group and unsaturated group, and (c) less than 5 parts by weight of additives consisting of flame retardant, heat-stabilizer, chain extender, and inorganic filler.
申请公布号 KR100316436(B1) 申请公布日期 2001.11.21
申请号 KR19940036010 申请日期 1994.12.22
申请人 SK CHEMICALS. CO., LTD. 发明人 HONG, YOON HEE
分类号 C09J177/00;(IPC1-7):C09J177/00 主分类号 C09J177/00
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