发明名称 METHOD AND APPARATUS FOR SPRAY/APPLICATION
摘要 PROBLEM TO BE SOLVED: To provide a method capable of automatically coating the small- diameter hole of a substrate such as a lead wire-embedding home formed in a sliding brush body with a coating such as a silver paste, and provide an apparatus for the method. SOLUTION: In the method and the apparatus, a nozzle 10 arranged opposite to the small-diameter hole of the substrate 81, an air supply mechanism 20 for atomization which supplies air for atomizing the coating P to the nozzle 10, a coating supply mechanism 30 which supplies the coating P to be atomized by the air to the nozzle 10, and an air supply mechanism 40 for spray which ejects the coating P atomized in the nozzle 10 are provided.
申请公布号 JP2001321702(A) 申请公布日期 2001.11.20
申请号 JP20000146361 申请日期 2000.05.18
申请人 TOSHIBA CERAMICS CO LTD 发明人 OTSU AKIRA
分类号 B05D1/02;B05B7/04;B05B12/12;B05C5/00;B05C11/10;(IPC1-7):B05B7/04 主分类号 B05D1/02
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