发明名称 ANTISTATIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an antistatic resin composition which is excellent in antistatic performance such as antistatic property and charge removal as well as in the retention of the performance, can be molded without a surface contamination caused by the breeding out of an additive for example, and hence can be suitably used as a packaging resin especially for an electronic device composed of precision parts. SOLUTION: The antistatic resin composition comprises 1-5 wt. parts of an ester having an aliphatic ether bond in the molecule, 0.1-2 wt. parts of N- polyoxyalkylene-N,N,N-trialkyl ammonium salt represented by formula (1), 0.1-2 wt. parts of an anionic surfactant and 1-10 wt. parts of a polyester plasticizer relative to 100 wt. parts of a polyvinyl chloride resin wherein any one of R1, R2 and R3 is a 5-24C alkyl group, the others are 1-5C alkyl groups, A is a 2-4C alklene group, n is a positive integer of 1-15, and X- is an anion derived from hybrochtoric acid, chloric acid or perchloric acid.
申请公布号 JP2001323122(A) 申请公布日期 2001.11.20
申请号 JP20000138941 申请日期 2000.05.11
申请人 SEKISUI CHEM CO LTD 发明人 HORIOKA MIKIHIKO
分类号 C08L27/06;C08K5/10;C08K5/19;C08K5/42;C08L23/04;C08L23/10;C08L67/00;(IPC1-7):C08L27/06 主分类号 C08L27/06
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