| 摘要 |
<p>PROBLEM TO BE SOLVED: To extremely lessen the adhering area between only the semiconductor elements aimed at pickup using a suction collect and an adhesive sheet to facili tate pickup of the elements, and also to secure the adhering area necessary for the pickup of semiconductor elements other than the above semiconductor elements. SOLUTION: When an adhesive sheet with semiconductor elements placed on its surface in a state that the elements are adhered to the sheet is sucked from its lower part with a negative pressure and is made to separate from the elements, the shape of the suction openings of negative pressure suction holes provided in a jig placed with the sheet is formed into such a shape as the adhering area between the elements, and the sheet is reduced in a stepwise manner with the intermittent traveling of the sheet.</p> |
