发明名称 |
Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device |
摘要 |
The invention provides a method for readily forming a bump with a desired width, a semiconductor device and a method for making the same, a circuit board, and an electronic device. A method for forming a bump includes forming an opening in an insulating film which exposes at least a part of a pad, and forming the bump so as to be connected to the pad. A resist layer 20 defines a through hole which extends over at least a part of the pad in plan view. A metal layer is formed in the opening so as to connect to the exposed portion of the pad.
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申请公布号 |
US2001040290(A1) |
申请公布日期 |
2001.11.15 |
申请号 |
US20010843924 |
申请日期 |
2001.04.30 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
SAKURAI KAZUNORI;OTA TSUTOMU;MATSUSHIMA FUMIAKI;MAKABE AKIRA |
分类号 |
H01L21/60;H01L23/31;H01L23/485;(IPC1-7):H01L23/48;H01L23/52;H01L29/40;H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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