| 摘要 |
The invention relates to a device for encapsulating electronic components, mounted on so-called lead frames, in a mould assembled from two mould halves movable relative to each other and closable onto each other, comprising: means for causing the mould halves to move and to close, and means for exerting pressure on encapsulating material which can be placed in cavities of the mould, wherein the means for exerting pressure on the encapsulating material comprise at least two screw spindles, which screw spindles are driven by a cental drive and which by rotation of the screw spindles, support a displaceable fixing point for at least one plunger. <IMAGE> |
