| 摘要 |
PURPOSE: An apparatus for testing badness of a surface of a semiconductor wafer is provided to check badness of a surface of a wafer by using an optical method. CONSTITUTION: A CCD(Charge Coupled Device) camera(14) provides optical pattern data for a surface of a wafer. A camera driving portion(40) is used for driving the CCD camera(14). A motor(12) rotates a vacuum chuck. A motor driving portion(14) is used for driving the motor(12). A flat zone sensor portion(34) senses a flat zone of the wafer. A rotary angle sensor portion(36) senses a rotary angle of the vacuum chuck. A light source(15) irradiates light to a surface of the wafer. A luminous intensity control portion(54) controls luminous intensity of the light source(15). A reference data storage portion(38) stores optical pattern data under the predetermined luminous intensity. A display portion(50) displays a badness type of the surface of the wafer. A display control portion(48) controls the display portion(50). A test data storage portion(52) stores test data.
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