发明名称 |
WOOD FLOOR MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a wood floor material wherein pressure from below and joint opening after construction owing to inflation in damping or expansion and contraction in drying are difficult to be generated. SOLUTION: The wood floor material is provided wherein glued laminated thick veneer of almost the same quality as that of a glued laminated basic material main body is secured to a surface of the glued laminated basic material wherein an adhesive face of the glued laminated material is lengthwise arranged. A plurality of glued laminated thick veneers are laminated by using Japanese oak material to form a female and male actual part along almost an L-figure shape in a longish direction and in a shortish direction of the glued laminated wood main body.
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申请公布号 |
JP2001310309(A) |
申请公布日期 |
2001.11.06 |
申请号 |
JP20000127985 |
申请日期 |
2000.04.27 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
HAYASHI MORIO;FUKASHIRO YASUYUKI |
分类号 |
B27M3/04;B27M3/00;B32B21/13;E04F15/04;(IPC1-7):B27M3/04 |
主分类号 |
B27M3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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