发明名称 WOOD FLOOR MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a wood floor material wherein pressure from below and joint opening after construction owing to inflation in damping or expansion and contraction in drying are difficult to be generated. SOLUTION: The wood floor material is provided wherein glued laminated thick veneer of almost the same quality as that of a glued laminated basic material main body is secured to a surface of the glued laminated basic material wherein an adhesive face of the glued laminated material is lengthwise arranged. A plurality of glued laminated thick veneers are laminated by using Japanese oak material to form a female and male actual part along almost an L-figure shape in a longish direction and in a shortish direction of the glued laminated wood main body.
申请公布号 JP2001310309(A) 申请公布日期 2001.11.06
申请号 JP20000127985 申请日期 2000.04.27
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HAYASHI MORIO;FUKASHIRO YASUYUKI
分类号 B27M3/04;B27M3/00;B32B21/13;E04F15/04;(IPC1-7):B27M3/04 主分类号 B27M3/04
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