| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of dust by preventing the exfoliation of a laminated film by setting an end face of the laminated film of an edge of a device wafer formed with the laminated film, substantially perpendicular to the surface of a base plate. SOLUTION: A polishing site 7 is formed on the surface of a polishing element 4, by contact rotating of a molding 2 having a sectional shape substantially coincident with that of an edge 27 of the device wafer of a material 24 to be polished with the element 4. The edge 27 of the material 24 is contacted with the site 7, pressed, rotated, and polished to the sectional shape which is coincident with that of the site 7 of the element 4. Thus, since the end face of the laminated film 26 on the surface of the base plate 25 is polished not obliquely but perpendicularly and is removed, there is no possibility of the occurrence of the exfoliation of the laminated film which becomes a foreign matter.
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