| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a module substrate that can be connected correctly to a mother board even if the mother board is warped. SOLUTION: A cover plate 7 is attached to the back surface 1B of a work substrate 1 that is divided into a divided substrate 6 and the rest of the work substrate 1C. A solder ball 10 is bonded on a cream solder 8 after a back electrode 4 is coated with the cream solder 8. Under such conditions, the solder ball 10 is molten by heating the divided substrate 6, etc. Consequently, the molten solder ball 10 penetrates into a through hole 2 along the back electrode 4 and a side electrode 5, and the part of the ball adheres to the back electrode 4 and the side electrode 5 in a protruded form from the back surface 1B of the work substrate 1.</p> |
