SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which has a long life and a high reliability by suppressing the increase in temperature of an aluminum bonding pad due to heat transmitted through a semiconductor substrate in the semiconductor device, to prevent the growth of voids or generation of corrosion in a joint between a gold wire and aluminum, and also provide a method of manufacturing the same. SOLUTION: In the semiconductor device having the aluminum bonding pad 3 on the semiconductor substrate 1, a heat insulation region 2 for shielding the heat transmitted to the bonding pad 3 through the semiconductor substrate 1 is formed of a heat insulation material, The semiconductor device is manufactured by a method wherein a wire bonding is carried out with a pad supporting section being supported by an auxiliary member from the rear face side and thereafter the auxiliary member is removed and then the heat insulation region is formed.