| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip type electronic part having a molded resin exterior structure for reducing the number of parts, preventing a crack at the molded resin exterior even under high-temperature environment, such as a solder re-flow condition, and reducing the height of the whole body. SOLUTION: The electronic part has at least one pair of electrode plate lead terminals 1 and 2, not coming in contact mutually. The pair of electrode plate lead terminals 1 and 2 have each C shaped hanging part 11 or 21, and the hanging part 11 and 21 are so located that these parts are overlapped and hung on each other. In a molding step, the mold resin of the mold resin exterior 4 is made to flow into a space between the hanging parts 11 and 21, and the pair of electrode plate lead terminals 1 and 2 are insulated thereby.</p> |
