| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of withstand voltage and moisture resistance in which an interval between a radiation plate and an electrode part approaches in a surface mounting type semiconductor device using a plate-like lead frame. SOLUTION: A lead frame in which islands 12 are arranged between a pair of band-like members 10, 11 at a prescribed interval, one end side of each island 12 is connected to one band-like member 10, the other end side is connected to the other band-like member 11 through a connection bar 13, and the electrode parts 14, 15 extends from the other band-like member 11 to the island 12, and the surface mounting type semiconductor device in which a semiconductor pellet mounted on the island of the lead frame and the electrode part are electrically connected, the respective other main faces of the island and the electrode part and the respective outer end faces of the connection bar and the electrode part are exposed to be coated by resin, the width of the electrode part exposed from the external finish resin is set wider than that of the connection width, and one end side of the electrode part is lifted from the other main face of the island to be positioned in the external finish resin are provided. |
