发明名称 |
COMPOSITE DIELECTRIC MATERIAL, AND COMPACTING MATERIAL, COMPACTING POWDER MATERIAL, COATING MATERIAL, PREPREG AND SUBSTRATE ALL USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To obtain a composite dielectric material good in the dispersibility of grains, capable of easily obtaining desired characteristics and capable of attaining the thinning of electronic parts, or the like, and to obtain a compacting material, a compacting powder material, a coating material, a prepreg and a substrate all using the same. SOLUTION: This composite dielectric material is obtained by coating the whole or a part of the surfaces of spherical metallic grains 1 with the average grain size of 0.1 to 10μm with a dielectric layer 2 and dispersing the coated grains into a resin 10.
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申请公布号 |
JP2001303102(A) |
申请公布日期 |
2001.10.31 |
申请号 |
JP20000128283 |
申请日期 |
2000.04.27 |
申请人 |
TDK CORP |
发明人 |
TAKATANI MINORU;AKACHI YOSHIAKI;KOBUKE HISASHI |
分类号 |
C08J5/24;B22F1/02;C08K9/02;C08L101/00;H01G4/06;H01L23/29;H01L23/31;H05K1/03;(IPC1-7):B22F1/02 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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