| 摘要 |
A method is presented for stitch bonding wires to bonding pads on integrated circuit dies by using a tilted bonding capillary tip to prevent damaging the dies. The capillary tip has a face surface about the opening of the capillary. The face surface makes a face angle with respect to a capillary axis. The capillary tip is positioned in proximity to a bonding pad, and the tip is tilted by an angle less than the face angle. An end of a bonding wire is then stitch bonding to the bonding pad without damaging passivation layers on the integrated circuit die which surround the bonding pad. An apparatus permitting ball bonding and stitch bonding at a plurality of angular orientations is also disclosed. The invention should be particularly useful for electrically connecting integrated circuit dies to each other in multi-chip packages (MCP's). |
