发明名称 Method of forming the capacitor in DRAM
摘要 A method of forming a capacitor with a self-align structure on a substrate, the substrate including a word line and an active region, the method including the steps of forming a first dielectric layer on the active region and the word line with a planar top surface, creating a contact hole in the first dielectric layer with the self-align structure to expose portions of the active region and the word line, forming a conductive layer on the bottom of the contact hole, forming a polysilicon spacer on the sidewall of the contact hole, forming a dielectric spacer on the sidewall of the polysilicon spacer, filling the contact hole with a polysilicon bar, creating three sub-contact holes by etching back the polysilicon spacer and the polysilicon bar with part of the polysilicon spacer and the polysilicon bar remaining on the bottom, forming a hemispherical grain (HSG) layer on the surface of the sub-contact holes, depositing a second dielectric layer on the hemispherical grain, and forming a top electrode on the second dielectric layer.
申请公布号 US6309923(B1) 申请公布日期 2001.10.30
申请号 US20000620068 申请日期 2000.07.20
申请人 VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION 发明人 TSENG HORNG-HUEI
分类号 H01L21/02;H01L21/314;H01L21/316;H01L21/8242;(IPC1-7):H01L21/824;H01L21/20 主分类号 H01L21/02
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