RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a small resin-sealed semiconductor device having excellent heat radiation without a mechanical stress to a semiconductor pellet and a resin-sealed part. SOLUTION: A lower side of an outer edge 3a of a first lead 3 is flushed with a lower side of a resin-sealed part 2, and a rising part 3b continued to the outer edge 3a is buried in the resin-sealed part 2. An inner horizontal edge 3c continued to the rising part 3b of the first lead 3 and a semiconductor pellet 5 are connected with an internal flat lead 13. The semiconductor pellet 5 is stuck to an upper face on an inner edge 4c of a second lead 4, and the second lead 4 formed in a flat plate shape includes an outer edge 4a continued to the inner edge 5. The outer edge 4a is partly exposed from the resin-sealed part 2 to outside, and the entire lower side of the second lead 4 is made flush with the lower side of the resin-sealed part 2.