| 摘要 |
PROBLEM TO BE SOLVED: To provide a module which has a superior anti-solder crack property during a heat cycle and has a high reliability by using a material having specific material characteristics for an insulation layer of an insulation metal base circuit board. SOLUTION: The module uses the insulation metal base circuit board including the insulation layer having a value 1 or above for L, where L=-1.40E +4.45×10-3E2+3.72T-1.86T2, E is a storage modulus (unit; GPa) at 233 K, and T is a glass-transition temperature normalized at 300 K (T=Tg/300 K).
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