| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a low-skew signal line, which can handle high-speed signals. SOLUTION: The semiconductor device 1 has a substrate 2 made of silicon, a wiring layer 3 provided on the substrate, a plurality of signal interconnect lines 4 led around on the wiring layer and high-speed interconnect lines 5a, 5b, 5c. High-speed signals such as a clock signal are inputted from an inverter 6 and divided into the high-speed interconnect lines 5a, 5b, 5c by a plurality of inverters 7. Then, an inverter 8 is further connected to the high-speed interconnect line 5b provided in the middle among the high-speed interconnect lines 5a, 5b, 5c.
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