发明名称 VAPOR DEPOSITION SOURCE, PATTERNING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To carry out micropattern processing without using resist. SOLUTION: A vapor deposition source is constituted of a heating means 13 such as refractory metal resistor, a heating-region-restricting means 12 provided for the heating means 13, and a vapor deposition material 14 disposed in a manner to be partly brought into contact with the heating means 13. The restricting means 12 restricts the heat energy emitted from the heating means 13 only to the prescribed region. By this restricting means 12, the heat energy emitted from the heating means 13 is applied only to a specific part in the vapor deposition material 14. As the restricting means 12, a thermal insulation film 12 is used. An opening 15 is formed on a part of the thermal insulation film 12, and the selective emission region of the thermal energy from the heating means 13 is determined by means of the opening 15. Only the vapor deposition material 14 in contact with the heating means 13 inside the opening 15 is selectively evaporated and vapor deposited on the substrate to be subjected to vapor deposition.
申请公布号 JP2001295027(A) 申请公布日期 2001.10.26
申请号 JP20000116542 申请日期 2000.04.18
申请人 VICTOR CO OF JAPAN LTD 发明人 HIROSE SHINICHI
分类号 C23C14/24;C23C14/26;C23C14/28;H01L21/203;H01L21/285;(IPC1-7):C23C14/24 主分类号 C23C14/24
代理机构 代理人
主权项
地址