| 摘要 |
A universal design of a multiple layer printed circuit board incorporates a series of routing vias (51, 52, 53, 54) interconnecting a series of entry vias (30a, 30b, 30c, 30d) with a series of exit vias (34a, 34b, 34c, 34d). The routing vias connect all of the entry vias to all of the exit vias through junctions (a, b, c, d) spaced on the routing vias. The exit vias are located on a central portion (38) of the board having a copper coating on one side. The junctions are located on the via so that junctions may be selectively severed by means of a laser or high pressure water cutting system or other fine line cutting tool or mechanism to customize the circuit design for a particular semiconductor device or integrated circuit. Traces (58) are created leading from the exit vias (34) to probe pin contact points (62) by cutting through the copper coating using similar fine line cutting tools.
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