| 摘要 |
In a computer processor module/heat sink assembly, a spring clip member is used to resiliently hold a heat-generating die portion of the processor against the heat sink. Spaced retaining pins are secured to the processor module and extend through holes in the heat sink, with outer end portions of the retaining pins being captively retained in slots in the spring clip member, and portions of the clip member adjacent the outer pin ends being resiliently deformed toward the outer side of the heat sink to thereby resiliently press the processor die portion against the underside of the heat sink. The clip member may be quickly installed on and removed from the outer pin ends without the use of tools of any sort. In an alternate embodiment of the processor module/heat sink assembly, the retaining pins are secured to the heat sink and extend through holes in the processor module, with outer ends of the pins being captively and removably secured to the spring clip which is positioned on the outer side of the processor module.
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