发明名称 SOLDERING IRON
摘要 PROBLEM TO BE SOLVED: To provide a soldering iron by which a conductor can be fixed on a terminal board without floating uplift and by which the soldering efficiency working can be improved. SOLUTION: According to this invention, since a notch part 1a has been provided at the tip of a soldering iron tip 1, when solder 9 is melted into the part to be soldered from the above notch part 1a while clamping the terminal board 8 and the conductor 10 between this soldering iron tip 1 and the tip part 2 of a clamping part, soldering can be effectively performed without uplifting the conductor 10.
申请公布号 JP2001293561(A) 申请公布日期 2001.10.23
申请号 JP20000110874 申请日期 2000.04.12
申请人 HITACHI BUILDING SYSTEMS CO LTD 发明人 IZAWA SHIGENOBU;FUJITA YOSHIHIRO
分类号 B23K3/02;B23K1/00;(IPC1-7):B23K3/02 主分类号 B23K3/02
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