HEADER AND METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC EQUIPMENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a header including a semiconductor die and a method for manufacturing the header and electronic equipment using the header. SOLUTION: A header 100 is provided with a first contactor 110 and a second contactor 120 and an intermediate body 130. The intermediate body 130 is arranged between the first contactor 110 and the second contactor 120, and provided with an insulating part 135 having a cavity 140. Also, the intermediate body 130 is provided with a semiconductor die 150 arranged in the cavity 140, and matched so that a signal passing through at least a part of the header 100 can be adjusted.