Polish cleaning apparatus and method in manufacture of HGA

摘要

A new polish cleaning apparatus and a cleaning method are described for cleaning an HGA (head gimbal assembly) to meet the increasing requirements for cleanliness of read-write heads in the disk drive industry. The HGA polish cleaning apparatus includes an HGA polish cleaning assembly having a set of HGA carriers for effectively simultaneously polish clean a plurality of HGAs against a back and forth moving polish finger wrapped with anti-static polyester cloth. A plurality of HGAs to be polished are simultaneously loaded into the HGAs carriers which are then immersed in a polish cleaning tank containing a solution. The HGA carriers are driven by a pneumatic cylinder unit which is individually controlled by a programmable controller for exact polish cleaning. It also has a plurality of press-pins to fix the HGAs and supply proper friction between the slider ABS surface and the polish surface. The polish cleaning tank has an overflow weir, a pump, and a filter canister with a 0.2 micron filter cartridge for solution recirculation and filtering, it also has a thermostatically controlled strip heater to heat the solution to a good condition.