| 摘要 |
A method for fabricating row lines over a field emission array in which two mask steps are used to define row lines and pixel openings through selected regions of each row line. A first mask may be employed in the removal of dielectric material and conductive material from between pixel rows and from substantially above each pixel of the field emission array. A second mask may be used in the removal of semiconductor material from between the adjacent rows of pixels. Alternatively, a first mask may be employed in the definition of row lines, while a second mask may be used in the formation of pixel openings. Field emission arrays having a semiconductive grid and a relatively thin passivation layer exposed between adjacent row lines are also disclosed.
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