发明名称 |
Gehäusebaugruppe für ein elektronisches Bauteil |
摘要 |
The invention relates to a housing assembly for an electronic component (1) and to a method for packaging an electronic component, said housing assembly being provided with at least one electronic component (2) to the packaged, an outer support (3) and a housing frame (4). An epoxide resin that has a capillary effect is filled into the assembled housing assembly via a feed opening (7) and closes the cavities between the semiconductor chip and the housing frame by virtue of said capillary effect.
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申请公布号 |
DE10016135(A1) |
申请公布日期 |
2001.10.18 |
申请号 |
DE2000116135 |
申请日期 |
2000.03.31 |
申请人 |
INFINEON TECHNOLOGIES AG;SIEMENS AG |
发明人 |
FRIES, MANFRED;FISCHBACH, REINHARD;ZAESKE, MANFRED |
分类号 |
H01L23/28;H01L21/56;(IPC1-7):H01L23/057;H01L23/16;H01L21/52;H05K13/04 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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