发明名称 MOLDED ASSEMBLY WITH HEATING ELEMENT CAPTURED THEREIN
摘要 <p>A heated element assembly and method of manufacturing a heated element assembly is provided. The heated element assembly includes a first and second molded sections [150, 160] shaped to mate with each other. A resistance heating element [100] is secured between the first and second molded sections [150, 160] by an interference fit. The resistance heating element [100] includes a piercable supporting substrate [105] and a resistance wire [110] sewn thereon. The resistance wire [110] is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections [150, 160]. The resistance heating element [100] is easily fixed in a position between the first and second molded sections [150, 160] and is capable of providing heat on vertical, horizontal and contoured surfaces.</p>
申请公布号 WO2001078457(A2) 申请公布日期 2001.10.18
申请号 US2001011235 申请日期 2001.04.06
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