发明名称 |
FLAME-RETARDANT ACTIVE-ENERGY-RAY-CURABLE RESIN, FLAME- RETARDANT ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION, PRINTED CIRCUIT BOARD, AND MULTILAYRED PRINTED CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a nonhalogenous flame-retardant resin used, e.g. for an interlayer insulation layer of a multilayered printed circuit board; a flame- retardant resin composition containing the same; and a multilayered printed circuit board having a cured film formed from the composition. SOLUTION: This flame-retardant active-energy-ray-curable resin is prepared by reacting a novolak epoxy resin having a triazine structure with a free- radically polymerizable unsaturated monocarboxylic acid and reacting hydroxyl groups of the resulting product with a polybasic acid and/or its anhydride. The flame-retardant active-energy-ray-curable resin composition contains the resin, a reactive diluent, a photopolymerization initiator, and a thermosetting compound or further contains an inorganic hydrate. A printed circuit board and a multilayered printed circuit board, both having a cured film prepared from the composition, are provided. |
申请公布号 |
JP2001288245(A) |
申请公布日期 |
2001.10.16 |
申请号 |
JP20000100165 |
申请日期 |
2000.04.03 |
申请人 |
TAMURA KAKEN CO LTD |
发明人 |
AZUMA KENTARO;MIURA ICHIRO;ONO TAKAO |
分类号 |
C08J5/18;C08F2/44;C08F2/50;C08F290/06;C08G59/16;C08K3/22;C08L63/10;H05K3/46;(IPC1-7):C08G59/16 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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