发明名称 FLAME-RETARDANT ACTIVE-ENERGY-RAY-CURABLE RESIN, FLAME- RETARDANT ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION, PRINTED CIRCUIT BOARD, AND MULTILAYRED PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a nonhalogenous flame-retardant resin used, e.g. for an interlayer insulation layer of a multilayered printed circuit board; a flame- retardant resin composition containing the same; and a multilayered printed circuit board having a cured film formed from the composition. SOLUTION: This flame-retardant active-energy-ray-curable resin is prepared by reacting a novolak epoxy resin having a triazine structure with a free- radically polymerizable unsaturated monocarboxylic acid and reacting hydroxyl groups of the resulting product with a polybasic acid and/or its anhydride. The flame-retardant active-energy-ray-curable resin composition contains the resin, a reactive diluent, a photopolymerization initiator, and a thermosetting compound or further contains an inorganic hydrate. A printed circuit board and a multilayered printed circuit board, both having a cured film prepared from the composition, are provided.
申请公布号 JP2001288245(A) 申请公布日期 2001.10.16
申请号 JP20000100165 申请日期 2000.04.03
申请人 TAMURA KAKEN CO LTD 发明人 AZUMA KENTARO;MIURA ICHIRO;ONO TAKAO
分类号 C08J5/18;C08F2/44;C08F2/50;C08F290/06;C08G59/16;C08K3/22;C08L63/10;H05K3/46;(IPC1-7):C08G59/16 主分类号 C08J5/18
代理机构 代理人
主权项
地址