| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing semiconductor device capable of improving productivity by reducing working preparation time such as transfer, capable of reducing installation area of the apparatus by the miniaturization, and reducing the cost of the same. SOLUTION: This apparatus for manufacturing semiconductor device is composed of a wafer magazine 35, a wafer exchanger 38, an IC chip plunging mechanism 39, an IC chip supplier 30 and a spacer transfer/bond mechanism 52 having an IC chip transfer arm 40, a tape transfer means which carries a tape carrier 2, an X-Y-θtable 55 which lays a lead 2a of the tape carrier 2 on a pad 1a of an IC chip 1, a bonding apparatus 50 having a bonding head 13 which bonds the pad 1a and the lead 2a. The IC chip supplier 30 is connected to the bonding apparatus 50 by the IC chip transfer arm 40.</p> |
