发明名称 ELECTRONIC APPARATUS COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic apparatus cooling device with a simple structure which can carry out efficient cooling by forcibly cooling the apparatus by effectively conducting heat generated in the circuits toward a printed board cover. SOLUTION: An electronic apparatus 10 is constituted by allowing a heat dissipation silicon rubber sheet with low hardness to intervene between the circuit parts and a front printed board cover made of aluminum and between the rear surface of a printed wiring board and the front printed board cover made of aluminum to uniformly and immediately conduct heat generated in the circuit parts to printed board covers in front and rear sides. Furthermore, in order to efficiently flow cooling air between the electronic apparatuses, a guiding plate is provided near an outside air introducing port of a case 3 for housing the electronic apparatus 10, a partition 65 for adjusting a cross-sectional area of a ventilation path is provided near a ventilation path 63 to straighten air introduced from the outside, and the air flows uniformly in a predetermined direction between each electronic apparatus. Thus, the electronic apparatus can be cooled efficiently.
申请公布号 JP2001284862(A) 申请公布日期 2001.10.12
申请号 JP20000093642 申请日期 2000.03.30
申请人 TECH RES & DEV INST OF JAPAN DEF AGENCY 发明人 YONEYAMA TAKASHI;HASEGAWA TAKESHI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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