ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electronic circuit device whose mounting area can be reduced and which can be miniaturized and made low-cost. SOLUTION: An FET 17 and a thick-film printed resistance 18 are arranged so as to be adjacent on a ceramic substrate 11. The printed resistance 18 is formed by a printing method by using a palladium-silver (Pd-Ag) alloy so as to cross over interconnections 12, 13 which are arranged so as to be faced with each other. A copper (Cu) layer 19 as a low-impedance conductive material layer is laminated on the printed resistance 18 by a printing method in the same manner. When the printed resistance 18 is used as a shunt resistance, the mounting area of the electronic circuit device 10 can be reduced, and the circuit device can be miniaturized and made low-cost.