SOLDER BUMP FORMING METHOD, FLIP-CHIP MOUNTING METHOD AND MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a solder bump forming method, a flip-chip mounting method and a mounting structure in which the step for cleaning flux can be eliminated in order to reduce assembling cost. SOLUTION: Solder is mounted on an electrode via an active resin and then thermally fused and connected with a pad of an LSI chip, thus forming a solder bump.