发明名称 CIRCUIT-PATTERN FORMATION METHOD AND WIRING BOARD FORMED THEREBY
摘要 <p>PROBLEM TO BE SOLVED: To provide a circuit-pattern formation method in which the resolution of a circuit pattern formed by an electrophotographic method is high and in which the circuit pattern displays a good electric characteristic, and to provide a wiring board which is formed by the method. SOLUTION: The circuit-pattern formation method is constituted of a charging process in which the surface of a photoreceptor 12 is charged by a corona charger 11. The formation method is constituted of an exposure process in which the surface of the photoreceptor 12 is irradiated with a laser beam 13 so as to form a latent-image pattern. The formation method is constituted of a developing process in which a chargeable powder 15 for circuit formation is electrostatically attracted to the latent-image pattern on the surface of the photoreceptor 12 by a feed means 14. The formation method is constituted of a transfer process in which the chargeable powder 15 for circuit formation developed on the latent-image pattern is transferred onto a ceramic green sheet 16. The formation method is constituted of a fixing process in which the chargeable powder 15 for circuit formation transferred onto the green sheet 16 is fixed, and in which the circuit pattern is formed on the green sheet 16.</p>
申请公布号 JP2001284769(A) 申请公布日期 2001.10.12
申请号 JP20000091728 申请日期 2000.03.29
申请人 MURATA MFG CO LTD 发明人 KAMATA AKIHIKO;HAMANAKA TAKAYUKI
分类号 G03G9/08;H05K1/09;H05K3/12;H05K3/46;(IPC1-7):H05K3/12 主分类号 G03G9/08
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