Process for separating a semiconductor rod into a number of wafers comprises guiding a fluid on the surface of the rod and later in a cutting gap formed, and removing the dissolved reaction products with the fluid stream

摘要

Process for separating a semiconductor rod into a number of wafers comprises: guiding a fluid which dissolves the semiconductor material in a chemical reaction at a rate of 1-200 m/s using a transporting device on the surface of the rod and later in a cutting gap formed; and removing the dissolved reaction products with the fluid stream. Preferred Features: The fluid is either an alkali or mixtures of HF and HNO3 in a solvent. Thixotropic materials or agents are added to the fluid. The transporting device is a sheet, strip or yarn.