发明名称 THERMAL HEAD AND METHOD OF MANUFACTURING THE HEAD
摘要 PROBLEM TO BE SOLVED: To prevent adverse effect of accumulated heat by enhancing the heat dissipation performance of a thermal head. SOLUTION: A heating element is covered, on the vicinity thereof, with a protective film 216 covering a part of the first plane 208 of an elongated planar heat resistant substrate 100, the end face 202 of the elongated planar heat resistant substrate 100, and a part of the second plane 212 of the elongated planar heat resistant substrate 100. The first and second planes 208, 212 exposed from the protective film 216 are insulated electrically by a mesh-like insulation film 120 and a heat dissipater 230 for dissipating heat generated from a heater 110 is fixed to the first or second plane 208, 212 through the insulation film 120 and a fluid heat transmission substance 220 spreading into the insulation film 120.
申请公布号 JP2001277570(A) 申请公布日期 2001.10.09
申请号 JP20000092089 申请日期 2000.03.29
申请人 RICOH ELEMEX CORP 发明人 NISHIO TATSUO
分类号 B41J2/345;(IPC1-7):B41J2/345 主分类号 B41J2/345
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