发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a low breakdown voltage transistor having a stable characteristic without diffusion of boron in a polycrystalline silicon film which becomes a gate electrode to a semiconductor substrate and a high breakdown voltage transistor, having a gate insulting film whose film thickness is controlled on the same substrate. SOLUTION: An oxynitirde film 5 is formed in a low breakdown voltage transistor LMOS region and an oxide film 7 which becomes the gate insulating film of high breakdown voltage transistor HMOS is formed through a thermal oxidation processing. At that time, a low breakdown voltage transistor LMOS region is oxidized simultaneously and a laminated film, which becomes the gate insulating film 8 of the low breakdown voltage transistor and is constituted of the oxide film and the oxynitride film is formed.
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申请公布号 |
JP2001274260(A) |
申请公布日期 |
2001.10.05 |
申请号 |
JP20000084339 |
申请日期 |
2000.03.24 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
HASHIZUME TAKAHIKO;ARAI MASATOSHI |
分类号 |
H01L21/8234;H01L21/316;H01L21/318;H01L27/088;(IPC1-7):H01L21/823 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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