发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having a low breakdown voltage transistor having a stable characteristic without diffusion of boron in a polycrystalline silicon film which becomes a gate electrode to a semiconductor substrate and a high breakdown voltage transistor, having a gate insulting film whose film thickness is controlled on the same substrate. SOLUTION: An oxynitirde film 5 is formed in a low breakdown voltage transistor LMOS region and an oxide film 7 which becomes the gate insulating film of high breakdown voltage transistor HMOS is formed through a thermal oxidation processing. At that time, a low breakdown voltage transistor LMOS region is oxidized simultaneously and a laminated film, which becomes the gate insulating film 8 of the low breakdown voltage transistor and is constituted of the oxide film and the oxynitride film is formed.
申请公布号 JP2001274260(A) 申请公布日期 2001.10.05
申请号 JP20000084339 申请日期 2000.03.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HASHIZUME TAKAHIKO;ARAI MASATOSHI
分类号 H01L21/8234;H01L21/316;H01L21/318;H01L27/088;(IPC1-7):H01L21/823 主分类号 H01L21/8234
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