| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket and a semiconductor device wherein to connect an electrode terminal of a semiconductor device and electrodes formed with a wider distance than those of these electrode terminals and also to reduce the volume of an occupied area. SOLUTION: The IC socket 1 is the IC socket 1 to connect a plurality of electrodes on a circuit board 16 with a plurality of electrode terminals 5 on a semiconductor 4, and equipped with a base body 2, a plurality of connection electrodes 17 and a plurality of bottom wall electrodes 11. The base body contains a bottom wall 13 opposing to a face on which electrodes on the circuit board 16 are formed, and a mounting face 12 slanted against the bottom wall 13. A connection electrode is formed on the mounting face and connected respectively to the plurality of electrode terminals 5 of the semiconductor 4. The bottom wall electrode is electrically connected respectively to the plural connection electrodes and also, formed on the bottom wall of the base body, connected to the plurality of electrodes on the circuit board. Distances between the plural bottom electrodes 11 are larger than those between the plurality of connection electrodes 17.
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