| 摘要 |
PROBLEM TO BE SOLVED: To appropriately secure parallelism between paired lead members in a semiconductor device in which semiconductor elements are put between the lead members, in such a way that the members are jointed to both surfaces of the elements via solder members. SOLUTION: This semiconductor device is manufactured via a step of jointing the semiconductor elements 1 and 2 to the surface of a first lead member 3 via first solder members 4 and another step of mounting heat sinks 5 on the elements 1 and 2 and jointing a second lead member 7 to the heat sinks 5 via second solder members 6 having melting points lower than those of the first solder members 4. Thereafter, parallelism between the lead members 3 and 7 is adjusted by appropriately deforming the second solder members 6 by applying a pressure to the member 7 from the upside with a weight 101, while only the second solder members 6 are made to reflow. |
