发明名称 Mold for injection molding of disc substrate
摘要 A conduction means having conduction path for injecting molten molding material within a mold space is fitted to one of a pair of mold bodies which form the disc-shaped mold space. A first heat suppressing means for suppressing heat within the conduction path from being transmitted to the one of the mold bodies is disposed between the conduction means and the one of the mold bodies. Further, a second heat suppressing means is disposed at a position opposing to the first heat suppressing means at the time of mold-clamping the pair of the mold bodies.
申请公布号 US2001026817(A1) 申请公布日期 2001.10.04
申请号 US20010810228 申请日期 2001.03.19
申请人 PIONEER CORPORATION 发明人 SHIDA NORIYOSHI;SUGA KEIJI;IMAI TETSUYA
分类号 B29C45/26;B29C45/27;B29C45/73;G11B7/26;(IPC1-7):B29C45/00 主分类号 B29C45/26
代理机构 代理人
主权项
地址
您可能感兴趣的专利