| 摘要 |
<p>The present invention discloses a wet etching apparatus for semiconductor circuit and manufacturing method for etching needle used in its apparatus. The wet etching apparatus for semiconductor circuit includes a storage for storing wet etchant, a tube connected with the storage and having specific radius for injecting wet etchant to a specific part on semiconductor wafer, a unit for keeping semiconductor wafer, and a unit for situating the tube to the specific part of semiconductor wafer.</p> |
