Flux-application fixture for a ball-grid-array (BGA) assembly process

摘要

A flux-application fixture for applying flux to die pads in a ball-grid-array assembly process is provided. The fixture comprises a solid plate having a lower surface and an upper surface and a plurality of flux pins formed in the upper surface of the solid plate. The flux pins are contiguous with the solid plate and are formed by removing material from the upper surface of the plate such that the remaining material not removed forms the plurality of flux pins. In a preferred application the material is removed by grinding and the flux plate is ground flat to tight tolerance before removing the material to form the flux pins.