POLISHING DEVICE AND POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method capable of suppressing the excessive polishing of the outer peripheral end part of the polished face of a polished body such as a semiconductor wafer. SOLUTION: The polishing face 8a of a polishing tool 8 is brought into contact with the polished face of the wafer W so that a low-pressure region PL in the pressure distribution PR occurring at a contact part between the polishing face 8a and the polished face of the wafer W is located at the outer peripheral end part EG of the polished face and a high-pressure region PH is located on the inside of the polished face. After the polishing face 8a is brought into contact with the polished face, the polishing tool 8 is relatively moved in the radial direction of the wafer W for polishing.