| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which ensures a high connection reliability of a semiconductor device having fine-pitched terminals of a chip size package(CSP), etc. SOLUTION: In a printed wiring board 200 having electrode pads 5 for surface-mounting a semiconductor device with solder balls on an insulation board 1, the electrode pads 5 are composed of a first plane conductor layer 2 and a second rugged conductor layer 4 to increase the bond area of the electrode pad 5 to the solder.
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