| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition with high reliability, exhibiting good reflow resistance even if a reflow temperature is changed to 260 deg.C according to the trend directed to lead-free state, and further to provide a package with the high reliability by using the liquid resin composition. SOLUTION: This liquid resin composition comprises a filler (A), a liquid epoxy resin (B), a bismaleimide compound and/or a prepolymer thereof (C), and a curing agent (D), regulated so that the amount of the component (C) may be 4-35 pts.wt. based on 100 pts.wt. epoxy resin (B). The semiconductor device is obtained by using the liquid resin composition as a die attach paste.
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