Polishing pads and methods relating thereto

摘要

This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The polishing pads of the present invention are formed by sintering or a combination of sintering and molding (including reaction injection molding). The polishing pads of the present invention are made of an advantageous hydrophilic polishing material and have a surface topography and texture which improves their polishing performance.