发明名称 LAMINATION APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a lamination apparatus used in a process for manufacturing both surfaces or a multilayered substrate which is fine and high in mounting efficiency and requires no plating process. SOLUTION: The lamination apparatus is constituted of a supply part 11 comprising a charging loading 13 equipped with pads 12 for sucking and holding a prepreg 1, film material supply parts 4 comprising an unwinding shafts 7 around which a film materials 2 are wound, a bonding part 16 having heating rollers 18 and cooling rollers 19 and bonding the film materials 2 to the upper and rear surfaces of the prepreg l to form a laminate 3, a cutting part 20 consisting of a cutter blade 22 for cutting the joint 3d of the laminate 3 and feed rollers 23, a dancer part 24 including a freely rotating roller 25 and having an arm 27 freely revolving around a fulcrum shaft 26 and an angle measuring instrument 28 for detecting the angle of the arm 27 and a taking-out part 34 comprising a taking-out loading 36 including a pad 35 for sucking and holding the laminate 3 cut into sheets.</p>
申请公布号 JP2001260156(A) 申请公布日期 2001.09.25
申请号 JP20000076092 申请日期 2000.03.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUNAOKA TAKEO;OCHI AKIO;NISHIMOTO NAOKI;MINAFUJI HIROTADA;OISHI KUNIHIKO
分类号 B29C43/18;B29C43/34;B29C43/52;B29K105/06;B29L9/00;B32B37/16;(IPC1-7):B29C43/18 主分类号 B29C43/18
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