| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a hollow package type electronic part, capable of enhancing the production efficiency and airtightness of the hollow package type electronic part, and a mold and a manufacturing apparatus therefore. SOLUTION: A lead frame 7 connected in a hooped state is inserted in molds X, Y and the end part of the lead frame 7 is embedded in a resin in a primary injection process to mold not only a main body 8 but also a lid 15 and, after the molds X, Y are opened, the main body 8 is moved to a secondary molding cavity 5 by a taking-up device and the lid 15 is moved to the secondary molding cavity 5 by a moving device and the molds X, Y are closed to mate the main body 8 and the lid 15 with each other in the molds and a resin is injected in the peripheral part of the mated part of them in a secondary injection process to integrate the main body 8 and the lid 15 to manufacture a finished product 14. |
