发明名称 COOLING STRUCTURE FOR HOUSING
摘要 PROBLEM TO BE SOLVED: To cool an electronic circuit package mounted on an electronic apparatus unit uniformly. SOLUTION: A plurality of louvers 10a, 10b, 10c, 10d fixed to the underside of an electronic apparatus unit 2 are secured to a housing 1 by means of screws and the intervals 11a, 11b, 11c, 11d of these louvers are set to satisfy a relation 11a<11b<11c<11d. Since the relation of intervals 11a<11b<11c<11d represents the degree of ventilation, cooling air can also be taken in from the underside of the rear surface of an electronic circuit package 4.
申请公布号 JP2001257495(A) 申请公布日期 2001.09.21
申请号 JP20000066918 申请日期 2000.03.10
申请人 OKI ELECTRIC IND CO LTD 发明人 MAEDA NAOAKI
分类号 F24F13/15;H05K7/20;(IPC1-7):H05K7/20 主分类号 F24F13/15
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