摘要 |
PROBLEM TO BE SOLVED: To cool an electronic circuit package mounted on an electronic apparatus unit uniformly. SOLUTION: A plurality of louvers 10a, 10b, 10c, 10d fixed to the underside of an electronic apparatus unit 2 are secured to a housing 1 by means of screws and the intervals 11a, 11b, 11c, 11d of these louvers are set to satisfy a relation 11a<11b<11c<11d. Since the relation of intervals 11a<11b<11c<11d represents the degree of ventilation, cooling air can also be taken in from the underside of the rear surface of an electronic circuit package 4.
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