发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a small-sized and lightweight heat sink which has high heat dissipating performance. SOLUTION: In this heat sink 1, a plate type heat pipe 5 is spirally formed. Heat pipe layers 5a, 5b, 5c of a heat receiving part are bonded in face to face with the surfaces and the backs each other from an outside loop of a swirl to an inside loop. Heat dissipating parts 5e, 5f, 5g are aligned by interposing radiation fins 7c, 7b, 7a from the outside loop of the swirl to the inside loop. Heat of a heat generating member 9 is conducted in the heat pipe layers of the heat receiving part which have a laminated structure to the thickness direction of the plate type heat pipe, passes the insides of the respective heat pipes, and is conducted to heat dissipating parts of the respective heat pipes and dissipated.
申请公布号 JP2001257300(A) 申请公布日期 2001.09.21
申请号 JP20000065926 申请日期 2000.03.10
申请人 TS HEATRONICS CO LTD 发明人 HAGIWARA KATSUYUKI
分类号 F28D15/02;H01L23/427;(IPC1-7):H01L23/427 主分类号 F28D15/02
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